European Semiconductor Atlas · 2026

125 fabs across 16 countries, and not one of them makes memory. This is every front-end wafer fab in the EU‑27 plus the UK, Switzerland and Norway. Europe runs deep in power, analog and compound semiconductors but stays thin at the cutting edge: a single plant makes leading-edge logic at volume, and nothing on the map produces the DRAM and flash that every phone and PC depends on.

Each dot is one fab campus, sized by investment. Colour marks what it makes:

• Silicon volume. Power, analog, sensor and microcontroller chips on mature processes (≈28 nm and older). The workhorses inside cars, factories and appliances.
• Leading-edge logic. The cutting edge (≤16 nm, EUV lithography) behind PCs, phones and data-centre servers. Europe has one volume fab.
• Compound semiconductors. Silicon-carbide, gallium-nitride and other III‑V materials for EV powertrains, fast chargers, radar and optics.
• Substrate & epitaxy. Not chips, but the raw wafers the fabs are built on.
• R&D / pilot. Research lines proving future processes, not volume production.

A dashed ring marks a fab under construction; a dark slash marks a cancelled one.