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Semiconductor Fabs in Europe: A Searchable List

Map of European semiconductor fab sites, with markers coloured by production category.
European Semiconductor Atlas, October 2026. Explore the interactive map.

Search and filter 127 fab records in Europe: 74 chip fabs, 31 research lines and 22 wafer plants. Plus 44 back-end and 89 equipment sites.

Every site in the European Semiconductor Atlas: 127 fab records in 16 countries, 44 back-end sites and 89 equipment sites. Search and filter each table and download it as CSV. Updated 26 October 2026.

Jump to: Front-end wafer fabs · Back-end sites · Equipment makers · EU research grants

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Front-end wafer fabs

Colour:Leading-edge logicSiliconCompound semiconductorOther or unspecified materialWafer plantResearch or pilot lineStatus:Not yet in productionCancelled or closedShow on the map

Front-end wafer fabs in Europe: 127 records, updated 2026-10-26. CC BY 4.0. Credit: European Semiconductor Atlas, richard-stahl.at.
CompanyCountryStatusTypeCityFinest nodeYear
Infineon TechnologiesVillach 300mm Thin-Wafer Power Fab (Innovation Fab)AustriaOperationalSpecialtyVillach–2021
Infineon TechnologiesVillach 200mm SiC Fab (CoolSiC)AustriaOperationalCompound semiconductorVillach–2025
Infineon TechnologiesVillach 200mm Silicon Power/Analog Fab (legacy)AustriaOperationalSpecialtyVillach–2000
ams OSRAMPremstaetten 200mm specialty fab (full-service foundry)AustriaOperationalSpecialtyPremstaetten (Unterpremstaetten, Graz area)180 nm1983
ams OSRAMPremstaetten new front-end fab (European Chips Act)AustriaUnder constructionSpecialtyPremstaetten (Unterpremstaetten, Graz area)–2030
BelGaNOudenaarde Fab (ex-onsemi Fab2 / AMIS / Mietec) — BelGaN GaN lineBelgiumCancelledCompound semiconductorOudenaarde350 nm2022
Thema FoundriesOudenaarde Photonics Fab (ex-BelGaN site)BelgiumAnnouncedFoundryOudenaarde–2027
imecimec 300mm advanced CMOS R&D pilot line (Leuven) incl. NanoIC High-NA EUV extensionBelgiumExpandingResearch pilot lineLeuven2 nm2026
imecimec 200mm cleanroom (Leuven)BelgiumOperationalResearch pilot lineLeuven––
onsemiRožnov 150mm Silicon Power Device FabCzech RepublicOperationalSpecialtyRožnov pod Radhoštěm800 nm2003
onsemiRožnov Silicon & SiC Crystal Growth, Wafer & Epitaxy OperationsCzech RepublicExpandingWafer plantRožnov pod Radhoštěmn/a–
onsemiRožnov Vertically Integrated SiC Device Fab (new end-to-end SiC line)Czech RepublicAnnouncedCompound semiconductorRožnov pod Radhoštěm–2027
Topsil GlobalWafersTopsil GlobalWafers Frederikssund (float-zone / NTD / CZ silicon wafers; FZ300 300mm R&D)DenmarkExpandingWafer plantFrederikssundn/a2027
MurataVantaa MEMS Fab (ex-VTI Technologies)FinlandOperationalSpecialtyVantaa–1991
OkmeticVantaa Fab (existing 150/200mm line)FinlandOperationalWafer plantVantaan/a1997
OkmeticVantaa Fab Expansion (new 200mm fab, Koivuhaka)FinlandOperationalWafer plantVantaan/a2025
VTT / MicronovaMicronova Centre for Micro and Nanotechnology (incl. Kvanttinova RDI hub expansion)FinlandExpandingResearch pilot lineEspoo (Otaniemi)–2026
CEA-LetiCEA-Leti 200mm pilot line (CMOS + MEMS)FranceOperationalResearch pilot lineGrenoble–not found
CEA-LetiCEA-Leti 300mm silicon pilot platform (CMOS, photonics, 3D integration)FranceOperationalResearch pilot lineGrenoblenot found2004
CEA-LetiFAMES Pilot Line (300mm, building 41.03)FranceOperationalResearch pilot lineGrenoble7 nm2026
LIGENTECLIGENTEC France R&D CentreFranceResearch pilotResearch pilot lineCorbeil-Essonnes–2022
MACOM / OMMICMACOM European Semiconductor Center (former OMMIC III-V foundry)FranceOperationalCompound semiconductorLimeil-Brevannes40 nm–
MurataCaen Silicon Capacitor / IPD Fab (Murata Integrated Passive Solutions, ex-IPDiA)FranceExpandingSpecialtyCaen–2024
STMicroelectronicsCrolles 300mmFranceExpandingLogicCrolles28 nm2003
STMicroelectronicsCrolles 200mmFranceOperationalLogicCrolles130 nm–
STMicroelectronicsRousset 200mmFranceOperationalSpecialtyRousset90 nm2000
STMicroelectronicsTours 200mmFranceOperationalCompound semiconductorTours–not found
STMicroelectronics – GlobalFoundries JVCrolles 300mm ST-GlobalFoundries FD-SOI joint venture fabFranceAnnouncedFoundryCrolles18 nm2026
SoitecBernin 1 (200mm SOI substrate fab)FranceOperationalWafer plantBerninn/a1999
SoitecBernin 2 (300mm SOI fab)FranceOperationalWafer plantBerninn/a2003
SoitecBernin 3 (POI substrate fab)FranceOperationalWafer plantBerninn/a2020
SoitecBernin 4 (SmartSiC SiC substrate plant)FranceExpandingWafer plantBerninn/a2024
X-FABX-FAB France (Corbeil-Essonnes, former Altis Semiconductor)FranceOperationalFoundryCorbeil-Essonnes110 nmnot found
AZUR SPACE Solar PowerAZUR SPACE Heilbronn (Telefunken Technology Park)GermanyExpandingCompound semiconductorHeilbronn–1964
ESMC (TSMC + Bosch/Infineon/NXP JV)ESMC Dresden 300mm FabGermanyUnder constructionFoundryDresden12 nm2028 exp.
Ferdinand-Braun-Institut (FBH)FBH III-V Cleanroom (Cleanroom I & II)GermanyResearch pilotResearch pilot lineBerlin (Adlershof)100 nm1992
FraunhoferFraunhofer HHI Photonic InP Foundry / pilot line (Berlin)GermanyOperationalResearch pilot lineBerlin––
FraunhoferFraunhofer ENAS / Center for Microtechnologies (ZfM) cleanroom (Chemnitz)GermanyOperationalResearch pilot lineChemnitz––
FraunhoferFraunhofer IPMS Center Nanoelectronic Technologies (CNT) 300mm CMOS R&D line (Dresden)GermanyOperationalResearch pilot lineDresden22 nm2005
FraunhoferFraunhofer IPMS 200mm MEMS/MOEMS cleanroom (Dresden)GermanyOperationalResearch pilot lineDresden–2007
FraunhoferFraunhofer IPMS 200mm microdisplay / OLED-on-silicon cleanroom (Dresden)GermanyOperationalResearch pilot lineDresden–2008
FraunhoferFraunhofer IZM-ASSID 200/300mm 3D wafer-level integration pilot line (Dresden-Moritzburg)GermanyResearch pilotResearch pilot lineDresden-Moritzburg–2010
FraunhoferFraunhofer IMS 200mm CMOS line (Duisburg)GermanyOperationalResearch pilot lineDuisburg180 nm–
FraunhoferFraunhofer IISB pi-Fab silicon CMOS line (Erlangen, 200mm Si CMOS / 150mm HT-CMOS)GermanyResearch pilotResearch pilot lineErlangen–not found
FraunhoferFraunhofer IISB 150mm SiC power-device pilot line (Erlangen)GermanyOperationalResearch pilot lineErlangen–not found
FraunhoferFraunhofer IISB 200mm SiC line / demo lab (Erlangen, ramp-up)GermanyResearch pilotResearch pilot lineErlangen–not found
FraunhoferFraunhofer IAF III-V compound-semiconductor cleanroom / research fab (Freiburg)GermanyOperationalResearch pilot lineFreiburg im Breisgau50 nmnot found
FraunhoferFraunhofer ISIT 200mm MEMS / power line (Itzehoe)GermanyOperationalResearch pilot lineItzehoenot found1995
FraunhoferFraunhofer EMFT Munich microelectronics/microsystems line (150mm MEMS + 200mm CMOS pilot, 3D integration)GermanyResearch pilotResearch pilot lineMunich–2007
Freiberger Compound MaterialsFreiberg GaAs/InP/GaN substrate plantGermanyOperationalWafer plantFreibergn/a1997
GlobalFoundriesDresden Fab 1GermanyExpandingFoundryDresden22 nm2009
IHP (Leibniz)IHP 200mm SiGe BiCMOS Pilot LineGermanyResearch pilotResearch pilot lineFrankfurt (Oder)130 nm2021
Infineon TechnologiesDresden Wafer Fab (existing 200mm + 300mm)GermanyOperationalSpecialtyDresden–1995
Infineon TechnologiesSmart Power Fab Dresden (300mm, MEGAFAB-DD)GermanyOperationalSpecialtyDresden–2026
Infineon TechnologiesRegensburg Wafer Fab (150/200mm power & sensor)GermanyOperationalSpecialtyRegensburg–2000
IntelMagdeburg Megafab (Silicon Junction)GermanyCancelledLogicMagdeburgnot found–
NexperiaNexperia Hamburg wafer fabGermanyExpandingSpecialtyHamburg–1953
Robert BoschDresden Wafer Fab (300mm)GermanyExpandingSpecialtyDresden65 nm2021
Robert BoschReutlingen Wafer Fab (150mm/200mm)GermanyExpandingSpecialtyReutlingen180 nm1970
SiCrystal (ROHM)SiCrystal Nuremberg (Nordostpark) SiC substrate plantGermanyExpandingWafer plantNurembergn/a1997
SiltronicBurghausen (crystal pulling + 300mm wafer fab, global tech/R&D center)GermanyOperationalWafer plantBurghausenn/a1998
SiltronicFreiberg 300mm fab (Carl-Schiffner-Strasse 29)GermanyOperationalWafer plantFreibergn/a2004
TDK-MicronasFreiburg Wafer FabGermanyOperationalSpecialtyFreiburg im Breisgaunot found1960
Q.ANTQ.ANT Thin-Film Lithium Niobate Photonic Pilot Line (at IMS CHIPS)GermanyResearch pilotResearch pilot lineStuttgart–2024
TRUMPF Photonic ComponentsUlm VCSEL & Photodiode Cleanroom (TRUMPF Photonic Components HQ)GermanyExpandingCompound semiconductorUlm–2008
Texas InstrumentsFreising wafer fab (TI Deutschland)GermanyOperationalSpecialtyFreisingnot found1976
United Monolithic Semiconductors (UMS)UMS Ulm GaAs/GaN-on-SiC MMIC FabGermanyOperationalCompound semiconductorUlm100 nmnot found
Vishay IntertechnologyVishay Semiconductor Heilbronn wafer fabGermanyExpandingSpecialtyHeilbronn––
Vishay IntertechnologySiliconix Itzehoe 200mm power fabGermanyOperationalSpecialtyItzehoe–1996
Vishay IntertechnologySiliconix Itzehoe 300mm power fab (new 12-inch)GermanyUnder constructionSpecialtyItzehoe–2027
WolfspeedEnsdorf SiC Fab (Wolfspeed-ZF)GermanyCancelledCompound semiconductorEnsdorf––
X-FABX-FAB DresdenGermanyExpandingFoundryDresden350 nm–
X-FABX-FAB Erfurt (HQ)GermanyOperationalFoundryErfurt110 nm1992
X-FABX-FAB MEMS Foundry ItzehoeGermanyOperationalFoundryItzehoe–2009
ams OSRAMRegensburg OSRAM Opto Semiconductors chip fabGermanyOperationalCompound semiconductorRegensburg–2003
nanoplus Nanosystemsnanoplus Gerbrunn laser fab and group holding siteGermanyOperationalCompound semiconductorGerbrunn–2001
nanoplus Nanosystemsnanoplus Meiningen laser fab and registered officeGermanyOperationalCompound semiconductorMeiningen–2009
Analog DevicesADI Limerick Wafer Fab (Raheen)IrelandExpandingSpecialtyLimerick180 nm1977
IntelFab 34IrelandOperationalLogicLeixlipnot found2023
IntelFab 24 (incl. Fab 24-2; legacy 200mm Fab 10/Fab 14 absorbed)IrelandOperationalLogicLeixlip16 nm2006
LFoundryLFoundry Avezzano (200mm fab)ItalyOperationalFoundryAvezzano65 nm1990
MEMC / GlobalWafersMerano crystal growth plant (silicon single-crystal / ingots)ItalyOperationalWafer plantMeranon/a1976
MEMC / GlobalWafersNovara FAB300 (300mm) + legacy 150/200mm silicon wafer linesItalyExpandingWafer plantNovaran/a2025
STMicroelectronicsAgrate Brianza R3 300mm (AG300)ItalyExpandingSpecialtyAgrate Brianza90 nm2022
STMicroelectronicsAgrate Brianza R3 300mm — Tower (TSIT) specialty foundry capacityItalyOperationalFoundryAgrate Brianza65 nm2024
STMicroelectronicsAgrate Brianza 200mm (AG200)ItalyOperationalSpecialtyAgrate Brianza––
STMicroelectronicsCatania 150/200mm power & SiC/GaN device fab (existing)ItalyExpandingCompound semiconductorCatania–1997
STMicroelectronicsCatania Silicon Carbide Campus (200mm SiC device fab)ItalyOperationalCompound semiconductorCatania–2026
STMicroelectronicsCatania SiC substrate and epiwafer plantItalyExpandingWafer plantCatanian/a2026 exp.
Vishay IntertechnologyVishay Semiconductor Italiana wafer fab (Borgaro Torinese)ItalyOperationalSpecialtyBorgaro Torinese (Turin)–1995
MESA+ Institute for Nanotechnology, University of TwenteMESA+ NanoLab cleanroom (NanoLabNL Twente)NetherlandsResearch pilotResearch pilot lineEnschede100 nm2010
NXP SemiconductorsNijmegen ICN8NetherlandsOperationalSpecialtyNijmegen––
SMART PhotonicsEindhoven InP PIC Foundry (High Tech Campus, 100mm line)NetherlandsOperationalFoundryEindhoven–2024
TNOEindhoven 6-inch InP Photonic Chip Pilot Line (PIXEurope, TNO-operated)NetherlandsUnder constructionResearch pilot lineEindhoven–2027 exp.
imecJoint imec-ASML High-NA EUV Lithography Lab (Veldhoven)NetherlandsResearch pilotResearch pilot lineVeldhoven2 nm2024
nanoPHAB B.VnanoPHAB nanophotonics micro-fab (NanoLab@TU/e)NetherlandsOperationalCompound semiconductorEindhoven–2015
SINTEFSINTEF MiNaLab (Micro- and Nanotechnology Laboratory)NorwayResearch pilotResearch pilot lineOslo–2004
Safran Sensing Norway ASHorten MEMS Fab (Sensonor / Safran Sensing Technologies Norway)NorwayOperationalSpecialtyHorten–1985
VIGO PhotonicsOżarów Mazowiecki HQ fab (compound-semi epitaxy + IR detector line)PolandOperationalCompound semiconductorOżarów Mazowiecki–2013
VIGO PhotonicsHyperPIC / MIRPIC mid-IR photonics foundryPolandAnnouncedCompound semiconductorOżarów Mazowiecki area (exact site not disclosed)–n/a
Instituto de Microelectrónica de Barcelona , CSICIMB-CNM Integrated Micro and Nanofabrication Clean Room (Sala Blanca SBCNM, MICRONANOFABS node)SpainOperationalResearch pilot lineCerdanyola del Vallès (Bellaterra), Barcelona–1991
imecimec 300mm R&D pilot line (Malaga / Andalusia)SpainAnnouncedResearch pilot lineMalaga–n/a
Coherent (ex-II-VI)Coherent Jarfalla 6-inch InP wafer fabSwedenExpandingCompound semiconductorJarfalla–not found
Coherent (ex-II-VI)Coherent Kista SiC substrate & epitaxy line (ex-Ascatron)SwedenCancelledWafer plantKista, Stockholmn/a2014
STMicroelectronicsNorrkoping SiC substrate and epiwafer fab (ex-Norstel)SwedenOperationalWafer plantNorrkopingn/a–
Coherent (ex-II-VI)Coherent Zurich III-V laser fab (II-VI Laser Enterprise GmbH)SwitzerlandOperationalCompound semiconductorZurich–1998
EM Microelectronic (Swatch)EM Microelectronic Marin Front-End FabSwitzerlandOperationalSpecialtyMarin-Epagnier (La Tene), Neuchatel180 nmnot found
Hitachi EnergyLenzburg Power Semiconductor Front-End Fab (ex-ABB Semiconductors)SwitzerlandOperationalSpecialtyLenzburg–1981
Hitachi EnergyHitachi Energy 300mm IGBT Wafer R&D / Pilot LineSwitzerlandResearch pilotResearch pilot lineLenzburg–not found
LIGENTECLIGENTEC HQ / R&D and cleanroom (EPFL Innovation Park, Building L)SwitzerlandResearch pilotResearch pilot lineEcublens (Lausanne)–2016
Safran TimingYverdon-les-Bains MEMS Fab (Colibrys / Safran Timing Technologies SA)SwitzerlandOperationalFoundryYverdon-les-Bains––
Octric SemiconductorsOctric Semiconductors Newton Aycliffe compound semiconductor fabUnited KingdomOperationalCompound semiconductorNewton Aycliffe, County Durham––
Diodes IncorporatedGreenock wafer fab (GFAB)United KingdomOperationalSpecialtyGreenock–not found
Diodes IncorporatedOldham wafer fab (OFAB)United KingdomOperationalSpecialtyOldham–2008
IQEIQE Cardiff (St Mellons) — HQ epitaxy & Innovation CentreUnited KingdomOperationalWafer plantCardiff (St Mellons)n/anot found
IQEIQE Milton Keynes (Tongwell) — Wafer Technology III-V substrates & epitaxyUnited KingdomOperationalWafer plantMilton Keynes (Tongwell)n/a–
IQEIQE Newport "Mega Foundry" (Imperial Park / Celtic Way, Coedkernew)United KingdomExpandingWafer plantNewport (Coedkernew, Imperial Park)n/a2018
NexperiaNexperia Manchester (Hazel Grove) TrenchMOS wafer fabUnited KingdomOperationalSpecialtyStockport (Hazel Grove), Greater Manchester––
Plessey SemiconductorsPlymouth Roborough FabUnited KingdomOperationalCompound semiconductorPlymouth (Roborough)not found1985
Pragmatic SemiconductorPragmatic Park (300mm FlexIC line)United KingdomOperationalSpecialtyDurham600 nm2024
Pragmatic SemiconductorNETPark Fab (200mm FlexIC line, legacy)United KingdomClosedSpecialtySedgefield600 nm2018
Vishay IntertechnologyNewport Wafer Fab (Vishay Newport Limited)United KingdomOperationalSpecialtyNewport (Duffryn), South Wales180 nm1982
Silex MicrosystemsSilex MEMS Foundry, JärfällaSwedenOperationalFoundryJärfälla––
Element 3-5Element 3-5 SiCnature SiC Epiwafer PlantGermanyAnnouncedWafer plantBaesweilern/an/a
KETEKKETEK Munich cleanroom (silicon drift detectors)GermanyExpandingSpecialtyMunich–2008
X-FABX-FAB Fab4Micro (MEMS open foundry), ErfurtGermanyUnder constructionFoundryErfurt–2028 exp.
SoitecHasselt GaN epitaxial wafer siteBelgiumOperationalWafer plantHasseltn/a–

n/a does not applynot found no published figure was found– not yet researchedWhat the atlas knows

Back-end sites: assembly, test and packaging

Colour:Merchant (OSAT)CaptiveResearch pilot lineStatus:Not yet in productionCancelled or closedShow on the map

Back-end sites in Europe: assembly, test and packaging: 44 records, updated 2026-10-08. CC BY 4.0. Credit: European Semiconductor Atlas, richard-stahl.at.
CompanyCountryAccessAdvanced packagingCityStatus
Silicon Austria Labs (SAL) — FOWLP pilot line at SAL MicroFab, VillachSAL MicroFab, High Tech Campus VillachAustriaResearch pilot lineWafer-level fan-outVillachOperational
MelexisMelexis Ieper (headquarters/test/manufacturing site)BelgiumCaptiveNoneIeper (Ypres)Operational
imecimec Advanced Packaging / Chiplet Pilot Line (incl. NanoIC, FAMES)BelgiumResearch pilot line2.5D/3D, pilotLeuven (Heverlee)Research pilot
MelexisMelexis Sofia (Melexis Bulgaria)BulgariaCaptiveNoneSofiaExpanding
Sensata TechnologiesSensata Botevgrad (Sensata 3, formerly Sensor-Nite)BulgariaCaptiveNoneBotevgradOperational
Sensata TechnologiesSensata Maritsa/Tsaratsovo Plant (Plovdiv)BulgariaCaptiveNoneMaritsa Municipality (near Tsaratsovo village), Plovdiv RegionOperational
Hitachi Energy SemiconductorsHitachi Energy Semiconductors PragueCzech RepublicCaptiveNonePragueOperational
onsemi (ON Semiconductor)onsemi Rožnov pod RadhoštěmCzech RepublicCaptiveNoneRožnov pod RadhoštěmExpanding
Murata Electronics Oy (Murata Manufacturing)Murata Vantaa (Murata Electronics Oy technology center)FinlandCaptiveNoneVantaaOperational
Tampere University (SiPFAB) — Finnish Semiconductor Strategy / Chips JU WBG Pilot LineSiPFAB (System-in-Package Pilot Line), Tampere University, Hervanta Campus / Festia BuildingFinlandResearch pilot line2.5D/3D, pilotTampereUnder construction
VTT Technical Research Centre of Finland (Micronova / Kvanttinova, APECS consortium partner)VTT Micronova / Kvanttinova (Espoo) - APECS pilot lineFinlandResearch pilot line2.5D/3D, pilotEspooUnder construction
CEA-LetiCEA-Leti FAMES Pilot Line (MINATEC Campus)FranceResearch pilot line2.5D/3D, pilotGrenobleOperational
STMicroelectronicsST RennesFranceCaptiveNoneRennesOperational
STMicroelectronicsST Tours (panel-level packaging pilot line)FranceCaptive2.5D/3D, pilotToursUnder construction
Fraunhofer ENAS (part of APECS / FMD pilot line)Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz — APECS advanced packaging R&D pilot lineGermanyResearch pilot line2.5D/3D, pilotChemnitzOperational
Fraunhofer IPMSFraunhofer IPMS Dresden – APECS 300mm Pilot Line (CEASAX / Center Nanoelectronic Technologies)GermanyResearch pilot line2.5D/3D, pilotDresdenResearch pilot
Fraunhofer IZM (Fraunhofer Institute for Reliability and Microintegration)Fraunhofer IZM - Wafer Level System Integration (WLSI), BerlinGermanyResearch pilot line2.5D/3D, pilotBerlinOperational
Fraunhofer IZM-ASSID (All Silicon System Integration Dresden)Fraunhofer IZM-ASSIDGermanyResearch pilot line2.5D/3D, pilotMoritzburg (Dresden)Operational
GlobalFoundriesGlobalFoundries Dresden – Final Contacting (Bump and Sort) FacilityGermanyCaptiveNoneDresdenClosed
Infineon TechnologiesInfineon Regensburg (incl. Packaging Center Regensburg-Burgweinting)GermanyCaptive2.5D/3D, pilotRegensburgOperational
Infineon TechnologiesInfineon WarsteinGermanyCaptiveNoneWarsteinOperational
Melexis NVMelexis ErfurtGermanyCaptiveNoneErfurtOperational
Robert Bosch GmbH (Bosch Sensortec / Bosch Semiconductor)Bosch Reutlingen (wafer fab + on-site Test Center for Semiconductors)GermanyCaptiveNoneReutlingenOperational
Infineon TechnologiesInfineon Cegléd (Infineon Technologies Cegléd Kft. + Infineon Technologies Bipoláris Kft.)HungaryCaptiveNoneCeglédOperational
Robert Bosch (Robert Bosch Elektronika Kft.)Bosch Hatvan – Final Test CenterHungaryCaptiveNoneHatvanOperational
SensirionSensirion Hungary Kft. Debrecen plantHungaryCaptiveNoneDebrecenExpanding
Tyndall National Institute (University College Cork)Tyndall National Institute — Photonic Packaging Group / Device Forensics (FlexiFab back-end)IrelandResearch pilot line2.5D/3D, pilotCorkOperational
IntelIntel Vigasio advanced packaging & assembly plant (planned)ItalyCaptiveNoneVigasioCancelled
STMicroelectronicsSilicon Carbide Campus, CataniaItalyCaptiveNoneCataniaUnder construction
STMicroelectronicsItalyCaptiveNoneMarcianiseOperational
Silicon BoxSilicon Box NovaraItalyMerchant (OSAT)2.5D/3D, productionNovara (Agognate)Announced
STMicroelectronicsST Kirkop (STMicroelectronics Malta Ltd.)MaltaCaptiveNoneKirkopOperational
Sensonor AS (Safran Sensing Technologies Norway AS)Sensonor Horten MEMS manufacturing facilityNorwayCaptiveNoneHortenOperational
IntelIntel Wrocław (Miękinia) Semiconductor Integration and Test Facility — CANCELLED, never builtPolandCaptiveNoneWrocław (Miękinia commune)Cancelled
Amkor TechnologyAmkor Technology Portugal (ATEP)PortugalMerchant (OSAT)Wafer-level fan-outVila do CondeOperational
KDPOF / KD (Knowledge Development for POF, S.L.)KD (KDPOF) Tres Cantos optoelectronic packaging and test facilitySpainCaptiveNoneTres Cantos, MadridExpanding
Aptasic SAAptasic SA (Boudry HQ, now Eurofins Materials & Engineering Sciences)SwitzerlandMerchant (OSAT)NoneBoudryOperational
Hitachi Energy Semiconductors (formerly ABB Semiconductors)Hitachi Energy Semiconductors LenzburgSwitzerlandCaptiveNoneLenzburgExpanding
ALTER Technology (Alter Technology TÜV Nord)ALTER UK (ALTER Technology TÜV NORD UK Ltd, formerly Optocap)United KingdomMerchant (OSAT)NoneLivingston, ScotlandOperational
Compound Semiconductor Applications (CSA) CatapultCSA Catapult Innovation Centre — Advanced Packaging Prototype Facility / Power Packaging R&D LineUnited KingdomResearch pilot line2.5D/3D, pilotNewportOperational
Custom Interconnect Ltd (CIL)Custom Interconnect Andover BP2 (Blueprint 2 OSAT facility)United KingdomMerchant (OSAT)2.5D/3D, pilotAndoverOperational
Microchip TechnologyMicrochip Caldicot Advanced PackagingUnited KingdomCaptiveNoneCaldicotOperational
Sivers Photonics (formerly CST Global)Sivers Photonics — Hamilton International Technology ParkUnited KingdomMerchant (OSAT)NoneBlantyre, South Lanarkshire (Glasgow area)Operational
Diodes Incorporated (Diodes Zetex Neuhaus GmbH)Diodes Neuhaus am Rennweg assembly and testGermanyCaptiveNoneNeuhaus am RennwegOperational

Equipment makers

Colour:Lithography and opticsDeposition, etch and thermalTest and metrologyVacuum, RF and laser partsBonding and packagingShow on the map

Sites of semiconductor equipment makers in Europe: 89 records, updated 2026-10-26. CC BY 4.0. Credit: European Semiconductor Atlas, richard-stahl.at.
CompanyCountryDomainCityStatus
BE Semiconductor Industries (Besi) — Besi Austria GmbH / Datacon Technology GmbHBesi Austria GmbH / Datacon Technology GmbH — RadfeldAustriaBonding and packagingRadfeldOperational
EV Group (EVG)EV Group St. Florian am Inn (HQ, R&D and Manufacturing)AustriaBonding and packaging, Lithography, Metrology and inspection, Wet processing, OtherSt. Florian am InnExpanding
IMS Nanofabrication GmbHIMS Nanofabrication HQ / Manufacturing & R&DAustriaMask writingBrunn am GebirgeOperational
ASM InternationalASM International Leuven (ASM Belgium NV)BelgiumDepositionLeuvenOperational
Comet Group — Yxlon International A/S (Comet Technologies Denmark A/S)Yxlon International A/S (Comet Technologies Denmark A/S) — Taastrup plantDenmarkMetrology and inspectionTaastrupOperational
ASM InternationalASM International Helsinki (Corporate R&D / ASM Microchemistry)FinlandDepositionHelsinkiOperational
Picosun Oy (part of Applied Materials)Picosun Espoo (HQ / R&D)FinlandDepositionEspooOperational
AnnealsysAnnealsys HQ / Manufacturing / R&D — MontpellierFranceThermal, DepositionMontpellierOperational
Laser Systems & Solutions of Europe SASU (LASSE)LASSE — GennevilliersFranceThermalGennevilliersOperational
MKS Instruments (Micro-Contrôle Spectra-Physics S.A.S / MKS Group)Micro-Contrôle Spectra-Physics — Beaune-la-Rolande plantFranceLasers and optics, Metrology and inspection, OtherBeaune-la-RolandeOperational
MKS Instruments (Micro-Contrôle Spectra-Physics)MKS Instruments / Micro-Contrôle Spectra-Physics — Brigueuil manufacturing plantFranceOtherBrigueuilOperational
Pfeiffer VacuumPfeiffer Vacuum France (Annecy plant)FranceVacuum and RF parts, Metrology and inspectionAnnecyOperational
Plasma-Therm Europe SAS (CORIAL by Plasma-Therm, incl. Kobus)Plasma-Therm Europe / CORIAL Grenoble-Bernin FacilityFranceDeposition, EtchBerninOperational
UnitySC (Unity Semiconductor SAS, part of Merck Group / Merck KGaA)UnitySC Global HeadquartersFranceMetrology and inspectionMontbonnot-Saint-MartinOperational
3D-Micromac AG3D-Micromac AG Headquarters and Production, ChemnitzGermanyLasers and optics, OtherChemnitzOperational
ASMLASML Berlin (ex-Berliner Glas)GermanyLithographyBerlinOperational
AdvantestAdvantest Europe GmbH – AmerangGermanyTestAmerangOperational
AdvantestGermanyTestBerlinOperational
AdvantestAdvantest Europe GmbH – BöblingenGermanyTestBöblingenOperational
AdvantestGermanyTestDuisburgOperational
AdvantestAdvantest Europe GmbH (regional HQ)GermanyTestMunichOperational
AixtronAixtron Herzogenrath (HQ)GermanyDepositionHerzogenrathOperational
Busch Vacuum Solutions (Busch Group) — Busch Produktions GmbHBusch Produktions GmbH / Busch SE Headquarters, MaulburgGermanyVacuum and RF partsMaulburgOperational
Carl Zeiss SMTCarl Zeiss SMT CoswigGermanyLithographyCoswigOperational
Carl Zeiss SMTCarl Zeiss SMT JenaGermanyMask writing, Metrology and inspection, Lasers and opticsJenaOperational
Carl Zeiss SMTCarl Zeiss SMT WetzlarGermanyLithographyWetzlarUnder construction
Carl Zeiss SMT GmbHCarl Zeiss SMT AachenGermanyLithography, Lasers and opticsAachenOperational
Carl Zeiss SMT GmbHCarl Zeiss SMT Oberkochen (HQ)GermanyLithography, Lasers and opticsOberkochenOperational
Carl Zeiss SMT GmbHCarl Zeiss SMT RossdorfGermanyMetrology and inspection, OtherRossdorfOperational
Comet Group (Comet Yxlon GmbH / Comet Plasma Control Technologies)Comet PCT (Plasma Control Technologies) - RF Generator Center of ExcellenceGermanyOtherAachenOperational
Comet Group — Comet Yxlon GmbH (formerly Yxlon International GmbH)Comet Yxlon GmbH — Hamburg Headquarters, R&D & Manufacturing (IXS division)GermanyMetrology and inspectionHamburgOperational
ERS electronic GmbHGermanyBonding and packaging, Test, Metrology and inspectionBarbing (Regensburg)Operational
ERS electronic GmbHERS electronic GmbH HQ / Engineering Center / ProductionGermanyThermal, TestGermeringOperational
F&K Delvotec Bondtechnik GmbHF&K Delvotec Bondtechnik GmbH HeadquartersGermanyBonding and packagingOttobrunnOperational
Finetech GmbH & Co. KGGermanyBonding and packagingBerlinOperational
Heidelberg Instruments Mikrotechnik GmbHHeidelberg Instruments Mikrotechnik GmbH — HQ, Production & R&D Center (Wieblingen)GermanyMask writing, LithographyHeidelbergOperational
Hesse GmbH (Hesse Mechatronics)Hesse GmbH Headquarters and Production, PaderbornGermanyBonding and packagingPaderbornExpanding
Jenoptik AGJenoptik Airportpark Dresden micro-optics fabGermanyMask writing, Lasers and optics, OtherDresdenOperational
LPKF Laser & Electronics SELPKF Headquarters (Garbsen)GermanyLasers and optics, Etch, OtherGarbsenOperational
LayTec AGLayTec Headquarters and EpiX Manufacturing, BerlinGermanyMetrology and inspectionBerlinOperational
Leybold GmbH (Atlas Copco)Leybold GmbH HQGermanyVacuum and RF partsCologneOperational
Multiphoton Optics GmbHGermanyLithographyWürzburgOperational
Multitest Elektronische Systeme GmbH (now part of Cohu GmbH)Multitest Rosenheim plantGermanyTestRosenheimOperational
Nanoscribe GmbH & Co. KGNanoscribe Headquarters (ZEISS Innovation Hub @ KIT Campus North)GermanyLithography, Mask writingEggenstein-Leopoldshafen (Karlsruhe)Operational
PVA TePla Analytical Systems GmbHPVA TePla Analytical Systems GmbH — Westhausen (SAM manufacturing/application center)GermanyMetrology and inspectionWesthausenOperational
Pfeiffer VacuumPfeiffer Vacuum Dresden production siteGermanyVacuum and RF partsDresdenOperational
Pfeiffer VacuumPfeiffer Vacuum Components & Solutions GmbH (Pfeiffer Vacuum+Fab Solutions) — Göttingen production plantGermanyVacuum and RF partsGöttingenOperational
Pfeiffer Vacuum GmbHPfeiffer Vacuum GmbH — HQ & Manufacturing (Asslar)GermanyVacuum and RF partsAßlar (Asslar)Operational
QuantumDiamonds GmbHQuantumDiamonds Munich (HQ/R&D at Fraunhoferstrasse 17; new production plant under construction in Weisses Quartier, eastern Munich)GermanyMetrology and inspectionMunichUnder construction
RENA Technologies GmbHRENA Technologies Headquarters and Main Production, GütenbachGermanyWet processingGütenbachOperational
Raith GmbHRaith GmbH Headquarters (Phoenix West)GermanyLithography, Mask writing, Metrology and inspectionDortmundOperational
Rasco GmbH (Cohu / Cohu GmbH)Rasco GmbH (Cohu GmbH), Kolbermoor plantGermanyTestKolbermoorOperational
SENTECH Instruments GmbHSENTECH Instruments GmbH — Berlin-Adlershof HQ, R&D & ManufacturingGermanyEtch, Deposition, Metrology and inspectionBerlinOperational
SUSS MicroTecSUSS MicroTec Garching (HQ)GermanyLithography, Deposition, Wet processing, Metrology and inspection, Bonding and packagingGarchingOperational
SUSS MicroTecSUSS MicroTec SternenfelsGermanyBonding and packaging, Lithography, Wet processingSternenfelsOperational
TRUMPFTRUMPF Ditzingen (Group Headquarters)GermanyLasers and opticsDitzingenOperational
TRUMPF Hüttinger GmbH + Co. KG (TRUMPF group)TRUMPF Hüttinger FreiburgGermanyVacuum and RF parts, OtherFreiburg im BreisgauOperational
VON ARDENNE GmbHVON ARDENNE Dresden (HQ, central production, Technology & Application Center)GermanyDepositionDresdenOperational
Vistec Electron Beam GmbHVistec Electron Beam GmbH — Jena plantGermanyMask writing, LithographyJenaOperational
centrotherm international AGcentrotherm international AG — Blaubeuren HQGermanyThermal, DepositionBlaubeurenOperational
scia Systems GmbHscia Systems GmbH Headquarters / R&D / ManufacturingGermanyEtch, DepositionChemnitzOperational
Semilab Semiconductor Physics Laboratory Zrt.Semilab Headquarters (Budapest)HungaryMetrology and inspectionBudapestOperational
LPE S.p.A. (ETC)LPE S.p.A. Baranzate plant (ETC)ItalyDepositionBaranzate (Milan)Operational
SPEA S.p.A.SPEA S.p.A. Headquarters & Manufacturing PlantItalyTestVolpiano (TO)Operational
ASM InternationalASM International Almere (Versterkerstraat 8, HQ)NetherlandsDepositionAlmereOperational
ASMLASML Global Headquarters / Veldhoven CampusNetherlandsLithographyVeldhovenOperational
ASML / imecASML-imec High-NA EUV Lithography Lab, VeldhovenNetherlandsLithography, Metrology and inspectionVeldhovenOperational
BE Semiconductor Industries (Besi)Besi Duiven (Besi Netherlands B.V. / Group HQ)NetherlandsBonding and packagingDuivenOperational
Levitech BVLevitech Headquarters and ProductionNetherlandsDepositionAlmereOperational
TRUMPF HüttingerTRUMPF Hüttinger Kobyłka (CTPark Warsaw East)PolandOtherKobyłkaOperational
TRUMPF HüttingerTRUMPF Huettinger Zielonka (Greater Warsaw)PolandVacuum and RF partsZielonkaOperational
Pfeiffer VacuumPfeiffer Vacuum Srl Production Plant ApahidaRomaniaVacuum and RF partsApahida (Cluj)Operational
VAT Group AG — VAT Romania SRLVAT Romania SRL — Arad (legacy plant: Str. I, Zona Industrială Arad Vest nr. 9; new plant: VGP Park Arad, DN 69 KM 46+215)RomaniaVacuum and RF partsAradOperational
Sensofar-Tech, S.L. (Sensofar Metrology)Sensofar Metrology HQ / Manufacturing & R&DSpainMetrology and inspectionTerrassaOperational
Mycronic ABMycronic AB Headquarters / Pattern Generators Division, TäbySwedenMask writingTäbyOperational
Obducat ABSwedenLithographyLundOperational
Attolight SAAttolight HQ / R&D-Manufacturing Site (EPFL Innovation Park)SwitzerlandMetrology and inspectionLausanne (Ecublens)Operational
Carl Zeiss SMT (Carl Zeiss SMT Switzerland AG)Carl Zeiss SMT ZurichSwitzerlandLithography, OtherZurichOperational
Comet Group (Comet AG / Comet Holding AG)Comet AG Headquarters, FlamattSwitzerlandVacuum and RF parts, Metrology and inspectionWünnewil-FlamattOperational
Evatec AGEvatec AG Headquarters & Manufacturing Plant, TrübbachSwitzerlandDepositionTrübbachOperational
Heidelberg Instruments Nano AG (formerly SwissLitho)Heidelberg Instruments Nano AG - Zurich (Bandliweg 30)SwitzerlandLithography, Mask writingZurichOperational
VAT Group AG (VAT Vakuumventile AG)VAT Vakuumventile AG — Global HQ, Manufacturing & R&DSwitzerlandVacuum and RF partsHaag (Sennwald)Operational
Oxford Instruments Plasma TechnologyOxford Instruments Plasma Technology, YattonUnited KingdomEtch, DepositionYattonOperational
Plasma-Therm (Specialty Process Engineering Group)Plasma-Therm UK Ltd (Specialty Process Engineering Group)United KingdomEtch, DepositionSomertonOperational
SPTS Technologies (KLA Corporation)KLA SPTS Division R&D and Manufacturing FacilityUnited KingdomEtch, Deposition, Bonding and packagingNewportOperational
memsstar Ltdmemsstar Ltd - Livingston (Kirkton Campus)United KingdomDeposition, EtchLivingstonOperational
KLA (KLA-Tencor MIE GmbH)KLA-Tencor MIE GmbH, WeilburgGermanyMetrology and inspectionWeilburgOperational
AixtronAixtron CambridgeUnited KingdomDepositionCambridgeOperational
AixtronAixtron Turin production siteItalyDepositionTurinOperational

What the columns mean

Each fab record has one type and four facets. The type names the kind of site. The facets say what the site makes and how.

  • Type is one role per fab. If more than one role applies, the first match in this order wins: research or pilot line, wafer plant, foundry, compound semiconductor, memory, logic, specialty. A foundry makes chips that other companies design.
  • Material is the semiconductor material of the devices: silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), indium phosphide (InP) or other. GaN devices on silicon wafers count as GaN.
  • Function is what the devices do: digital, memory, analog and mixed-signal, power, RF, sensing, optoelectronics or other. Sensing devices measure a quantity: motion, fields, pressure, images or radiation. Optoelectronic devices emit, guide or modulate light, or convert it to power.
  • Form says how the maker builds the devices: integrated circuit, discrete, MEMS (small mechanical parts on a chip), passive or wafer. Lasers, LEDs and detector chips count as discrete devices. Wafer plants have the form "Wafer" and no function.
  • Process is the manufacturing process family of the fab, as in the processes post. A fab can run more than one. Click a process to read how it works.
  • An empty facet means that the sources do not say. The atlas does not guess a value from the type. The one exception is silicon for logic, specialty and memory fabs.
  • Finest node records a published nominal node or minimum feature dimension in nanometres. Node names are process labels, not a directly comparable transistor dimension. Branded process names remain in the details when no numeric dimension is published; scanner wavelength is excluded. Many specialty fabs do not publish a node.
  • Year is the year the fab opened. "Exp." marks the year in which a new fab expects to start production.
  • Investment is the published cost of the fab. Public funding shows one principal recorded funding item, linked to its evidence and labelled by instrument and scope. Operator/project and shared programme amounts have no sourced site allocation. They, repayable loans, mixed grant/tax aid without a grant-only split and public investment commitments are excluded from site grant totals. A Commission state-aid approval concerns national aid, not an EU grant. Approval does not mean payment.
  • Status uses the atlas words: announced, under construction, operational, expanding, research pilot, closed and cancelled.

For the back-end sites, Access says who the site works for. A merchant site, or OSAT (outsourced assembly and test), works for other companies. A captive site packages chips for its owner. Advanced packaging names the most advanced method at the site: wafer-level fan-out, flip-chip or stacked 2.5D/3D packaging.

For the equipment makers, Domain is the kind of machine or part. Sole supplier marks a manufacturing site associated with a sole supplier of a specified machine or part. It does not establish that every production step occurs exclusively at that site. Roles says if the site makes products, does research and development (R&D) or holds the headquarters.

The processes post explains how the manufacturing processes behind these facets differ. About the Atlas gives the sourcing rules.

What the atlas knows

An empty cell can mean three different things, and the tables keep them apart. "n/a" means that the field does not apply. A wafer plant has no node, and a fab that is not open has no opening year. "Not found" means that a search on the date in the CSV found no published figure. A dash means that the atlas has not researched the field yet.

This table counts the 127 fab records for each field.

Field Known Not found Not applicable Not yet researched
Year opened 87 14 6 20
Employees 79 19 0 29
Investment 60 36 0 31
Capacity 34 66 0 27
Finest node 34 7 22 64

Of the 44 back-end sites, 34 have an employee count and 31 have an opening year. Of the 89 equipment sites, 44 have an employee count and 22 have an opening year.

To report an error, use the "Report a correction" link in the details of a row. You can also write to kontakt@richard-stahl.at. I apply corrections and credit the sender.

EU research grants by operator

The European Commission publishes every grant of its Horizon research programmes in CORDIS. This table adds up the EU contribution for 54 operators in the atlas, from Horizon 2020 (2014 to 2020) and Horizon Europe (from 2021).

  • EU chip programmes counts the projects of the EU joint undertakings for chips: ECSEL (2014 to 2020), Key Digital Technologies (2021 to 2023) and the Chips Joint Undertaking (from 2024). The member states also pay a share of these projects. The table shows only the EU share.
  • The All Horizon grants column counts every Horizon grant to the operator, in any field. It includes the chip programmes.

Grants go to legal entities, not to fabs. The table has one row for each operator and does not show the grants for a site. Some legal entities do much more than chips, and the note names these cases. For example, the CEA total covers CEA as a whole, not only CEA-Leti. A group total also includes the entities of the group outside Europe.

The column "Public funding" in the fab table shows a different measure: recorded national aid, EU pilot-line grants and separately labelled shared programme amounts or loans. Part of the pilot-line money is in both counts, because the partners' Horizon share is also in CORDIS. Do not add the two together. Fab projects groups site grant approvals by status and lists selected projects; it is not a complete funding register.

Operator EU chip programmes, €m All Horizon grants, €m Projects Note
imec 594.5 876.2 505
CEA-Leti 338.6 1,331.6 1277 All of CEA, not only Leti
Fraunhofer 145.2 1,264.5 1871 All Fraunhofer institutes
Infineon Technologies 134.0 192.4 165
STMicroelectronics 119.9 158.2 163
ASML 59.4 59.4 25
Carl Zeiss SMT 38.4 38.7 12
Soitec 35.8 38.9 33
VTT / Micronova 34.3 529.7 772
NXP Semiconductors 32.8 48.1 82
Robert Bosch 27.1 94.9 165 The whole Bosch group (all fields)
Instituto de Microelectrónica de Barcelona, CSIC 11.3 799.6 1786 All of CSIC
MESA+ Institute for Nanotechnology, University of Twente 10.5 261.8 421 All of the University of Twente
X-FAB 8.7 12.7 20
Besi 5.0 6.0 17
IHP (Leibniz) 4.8 39.0 54
Aixtron 4.6 21.9 28
GlobalFoundries 4.5 5.4 11
ams OSRAM 3.5 8.9 18
SINTEF 3.2 334.5 468
LIGENTEC 3.2 10.5 20
BelGaN 3.1 5.0 5
Siltronic 3.1 3.1 11
SMART Photonics 3.0 11.6 19
Murata 2.5 3.2 14
United Monolithic Semiconductors (UMS) 1.9 2.6 7
TRUMPF 1.7 3.4 6
Okmetic 1.7 1.7 12
Coherent (ex-II-VI) 1.4 5.0 13
Freiberger Compound Materials 1.1 1.3 4
Nexperia 1.0 1.5 9
Silex Microsystems 0.9 3.9 5
LFoundry 0.6 1.0 6
ASM International 0.5 0.5 3
Analog Devices 0.4 2.2 10
onsemi 0.2 0.2 3
Intel 0.1 23.3 60 All Intel entities in the grant data, also in Israel and the US
KETEK 0.1 0.1 1
Vishay Intertechnology 0.1 0.1 1
Ferdinand-Braun-Institut (FBH) 0 67.4 118 All Forschungsverbund Berlin institutes
VIGO Photonics 0 5.9 15
nanoplus Nanosystems 0 5.6 7
MACOM / OMMIC 0 3.6 7
AZUR SPACE Solar Power 0 3.3 6
Pragmatic Semiconductor 0 3.0 9
IQE 0 1.4 7
Safran Timing 0 0.8 1
Topsil GlobalWafers 0 0.7 3
Plessey Semiconductors 0 0.5 1
MEMC / GlobalWafers 0 0.4 1
nanoPHAB B.V 0 0.2 1
Q.ANT 0 0.2 1
Texas Instruments 0 less than 0.1 1
TRUMPF Photonic Components less than 0.1 less than 0.1 1

The table includes only the operators that the search found in CORDIS. An operator that is not in the table got no Horizon grant, or uses a legal name that the search does not cover. The source is CORDIS open data, as of 2 October 2026 (© European Union, CC BY 4.0). The file eu-grants.json names the legal entities behind each total. The project-level funding ledger lists the participant records used to audit the aggregates. Totals sum CORDIS ecContribution; the ledger also retains netEcContribution, which can differ. These are recorded contributions, not evidence of cash payments.

Data date and licence

The data was last updated on 26 October 2026. The research snapshot is from June 2026 for the fabs and from July 2026 for the back-end and equipment sites. In October 2026 I checked the fab projects and many other fab records again, as Europe's Chip Fab Projects describes. Every record carries its sources. The tables show the first source of each record and a direct source for its recorded public funding.

The atlas is open data under CC BY 4.0. Please credit it as "European Semiconductor Atlas, richard-stahl.at". The full files have every source and the coordinates: fabs as CSV, fabs as GeoJSON, back-end sites as GeoJSON, equipment sites as GeoJSON and EU research grants as JSON.

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